YusoffFateh Amera Mohd, Abu BakarMaria, and Azman Jalar. “ TEMPERATURE-INDUCED THICKNESS REDUCTION OF MICROMECHANICAL PROPERTIES OF Sn-0.7Cu SOLDER ALLOY”. Materials and Technology 56, no. 4 (August 16, 2022): 373–379. Accessed April 17, 2026. https://mater-tehnol.si/index.php/MatTech/article/view/392.