A NON-DESTRUCTIVE METHOD FOR EVALUATING THE ADHESION BETWEEN THE LAYERS OF METAL-POLYMER-METAL COMPOSITE MATERIALS

  • Vladimir A. Glushchenkov Samara National Research University, Metal Forming Department, Samara, Russia
  • Heinz Palkowski Clausthal University of Technology, Institute of Metallurgy, Clausthal-Zellerfeld, Germany
  • Rinat Y. Yusupov Samara National Research University, Metal Forming Department, Samara, Russia
  • Denis A. Matveev Samara National Research University, Metal Forming Department, Samara, Russia
  • Mikhail Khardin Samara National Research University
Keywords: sandwich composite sheet, adhesion strength, magnetic pulse, non-destructive measurement

Abstract

Development of a non-destructive measuring technique for evaluating the bonding quality of metal-polymer-metal composite sheet materials is introduced. Sufficient adhesion is necessary to ensure further shaping steps or bearing loads when used without failure due to delamination. Much attention is paid to determining the quality of gluing. According to the patent-literature review, no non-destructive measuring or quality control of layers’ bonding quality over the entire surface has been found. Thus, a new technical solution is proposed for defining the quality of bonding between the layers by means of electrodynamic repulsion forces arising from the pulse current passing over the metal layers of a composite in the counter direction. The feasibility of the method is tested in laboratory conditions. For its implementation, the necessary values of the test parameters are obtained, i.e., the values of the current transmitted through metal layers. In addition, the possibility of detecting local defects of different shapes and sizes with the proposed method is estimated.

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Published
2024-02-05
How to Cite
1.
Glushchenkov VA, Palkowski H, Yusupov RY, Matveev DA, Khardin M. A NON-DESTRUCTIVE METHOD FOR EVALUATING THE ADHESION BETWEEN THE LAYERS OF METAL-POLYMER-METAL COMPOSITE MATERIALS. MatTech [Internet]. 2024Feb.5 [cited 2024Apr.24];58(1):3–8. Available from: https://mater-tehnol.si/index.php/MatTech/article/view/727