PREPARATION AND PROPERTY OF Ni/Ag-Cu POWDER COMPOSITE CONDUCTIVE PASTE
Keywords:
conductive paste, polyethylene terephthalate, thin film, modified polyurethane resin, corrosion resistance
Abstract
A composite conductive paste was prepared using Ni powder and Ag-Cu powder as the conductive fillers, and modified polyurethane resin (PUR) as the matrix. The conductive coatings were cured after being applied onto polyethylene terephthalate (PET) films. Results show that when the mass ratio of the Ag-Cu powder, Ni powder and resin matrix was 13 : 2 : 5, the resistivity of the prepared conductive paste reached a minimum value of 7.92 × 10–4 Ω·cm and the binding force between the conductive coating and PET film was 20.1 N. In addition, the prepared coatings also exhibited good corrosion resistance in a neutral corrosive environment. Even after being bent 50 times, they showed no significant change, still exhibiting good corrosion resistance and bending performance.
References
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2 X. K. Ji, X. C. Jin, C. Hou, G. S. Xiao, X. F. Shu, Loading rate response on shear mechanical properties of conductive adhesive with different silver contents, Journal of Adhesion Science and Technology, 34 (2020) 18: 1935-1946, doi:10.1080/01694243.2020.1749405
3 P. E. Lopes, D. Moura, L, Hilliou, B. Krause, P. PÖtschke, H. Figueiredo, R. Alves, E.Lepleux, L. Pacheco, M. C. Paive, Mixed carbon nanomaterial/epoxy resin for electrically conductive adhesives, Journal of Composites Science, 4 (2020) 3, 105, doi:10.3390/jcs4030105
4 Q. H. Tian, D. Deng, L. I. Yu, X. Y. Guo, Preparation of ultrafine silver powders with controllable size and morphology, Transactions of Nonferrous Metals Society of China, 28 (2018) 3: 524-533, doi:10.1016/S1003-6326(18)64685-0
5 W. Gang, W. Hui, Y. Cui, J. Bai, Preparation of micro-sized and monodisperse crystalline silver particles used for silicon solar cell electronic paste, Journal of Materials Science, 25 (2014) 1, 487-494, doi:10.1007/s10854-013-1613-4
6 Z. Liu, X. L. Qi, H. Wang, Synthesis and characterization of spherical and mono-disperse micro-silver powder used for silicon solar cell electronic paste, Advanced Powder Technology, 23 (2012) 2, 250-255, doi:10.1016/j.apt.2011.03.004
7 S. N. Liu, S. K. Tam, K. M. Ng, Dual-reductant synthesis of nickel nanoparticles for use in screen-printing conductive paste, Journal of Nanoparticle Research, 23 (2021) 3, 1-12, doi:10.1007/s11051-021-05191-8
8 T. H. Kim, H. Kim, H. J. Jang, N. Lee, S. H. Lee, Improvement of the thermal stability of dendritic silver-coated copper microparticles by surface modification based on molecular self-assembly, Nano Convergence, 8 (2021) 1, 1-8, doi:10.1186/s40580-021-00265-8
9 H. Y. Dong, X. Li, Y. Dong, S. H. Guo, L. F. Zhao, A novel preparation method of electrically conductive adhesives by powder spraying process, Materials, 12 (2019) 17, 2793, doi:10.3390/ma12172793
10 X. G. Cao, H. Y. Zhang, Fabrication and performance of silver coated copper powder, Electronic Materials Letters, 2012, 8 (2012) 4, 467-470, doi:10.1007/s13391-012-1110-6
11 J. J. Kim, H. W. Lee, V. V. Dabhade, S. R. Kim, W. T. Kwon, D. J. Choi, H. Kim, Y.Kim, Electro magnetic interference shielding characteristic of silver coated copper powder, Metals & Materials International, 16 (2010) 3, 469-475, doi:10.1007/s12540-010-0619-1
12 S. Y. Zhang, X. Q. Qi, M. Yang, Y. Cao, T. S. Lin, P. He, K. W. Paik, A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives, Journal of Materials Science: Materials in Electronics, 30 (2019) 10, 9171-9183, doi:10.1007/s10854-019-01246-8
13 S. J. Peighambardoust, H. Rikhtegar, P. P. Mohammadzadeh, A. Mirmohseni, Electrically conductive epoxy-based nanocomposite adhesives loaded with silver-coated copper and silver-coated reduced graphene oxide nanoparticles, Polymers for Advanced Technologies, 30 (2019) 8, 1996-2004, doi:10.1002/pat.4632
14 A. Mik, B. Ebc, A. Jhl, Improved sinter-bonding properties of silver-coated copper flake paste in air by the addition of sub-micrometer silver-coated copper particles-science direct, Journal of Materials Research and Technology, 9 (2020) 6, 16006-16017, doi:10.1016/j.jmrt.2020.11.069
15 Y. Shi, Y. Wu, Z. Zhu, Modification of aqueous acrylic-polyurethane via epoxy resin post crosslinking, Journal of applied polymer science, 88(2003)2, 470-475, doi:10.1002/app.11750
16 B. Han, S. Zhu, W. W. Dong, Y. F. Bai, H. Ding, Y. L. Luo, P. Di, Improved electrochemical corrosion resistance of hot-press sintered WC-Al2O3 composites with added TiC in alkaline solutions, Ceramics International, 47(2021)22, 32168-32178, doi:10.1016/j.ceramint.2021.08.109
17 Y. Y. Li, T. S. Cao, D. Y. Wang, J. Zhao, C. M. Bao, Y. K. Song, X. M. Meng, C. Q.Cheng, Electrochemical corrosion of FV520B stainless steel in solutions bearing hydrogen bromide and acetic acid at high temperature from 130 to 200℃, Corrosion Engineering, Science and Technology, 56 (2021) 7, 639-647, doi:10.1080/1478422X.2021.193330
18 S. P. Rosoiu, S. Costovici, C. Moise, A. Petica, L. Anicai, T. Visan, M. Enachescu, Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents, Electrochimica Acta, 32 (2021) 19, 24152-24167, doi:10.1016/j.electacta.2021.139339
Published
2022-06-03
How to Cite
1.
Lian F, Su X, Liu Y. PREPARATION AND PROPERTY OF Ni/Ag-Cu POWDER COMPOSITE CONDUCTIVE PASTE. MatTech [Internet]. 2022Jun.3 [cited 2025Mar.25];56(3):245–253. Available from: https://mater-tehnol.si/index.php/MatTech/article/view/360
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