STRESS ANALYSIS AND NUMERICAL SIMULATION STUDY OF COLD METAL TRANSFER WELD HEAD

  • Mei Li College of mechanical engineering, Shenyang University, Shenyang 110044, China
  • Fu Yang College of mechanical engineering, Shenyang University, Shenyang 110044, China
  • Xiaolong Wei College of mechanical engineering, Shenyang University, Shenyang 110044, China
  • Zheng Jia College of mechanical engineering, Shenyang University, Shenyang 110044, China
Keywords: cold metal transfer welding, Q235 steel plate, stress analysis, numerical simulation, weld parameter

Abstract

In order to study stress and deformation during welding, the macroscopic and microscopic morphologies of the welded joints were recorded to obtain the best welding parameters. Taking a Q235 steel plate as the specimen, six groups were welded under different welding parameters using the cold metal transfer method. The stress field and deformation field in the welding process were simulated using the finite element method. The simulation results were used to further explain the experimental findings and to compare them with the experimental data. The results show that an excessive welding current aggravates the stress concentration of the joint and reduces the fatigue strength of the joint. If the welding current is too small, the stress of the base metal after welding is small, and there are defects including incomplete penetration and undercut. By comparison, the optimal welding parameters are identified as a current of 180 A, a voltage of 14.0 V, a welding speed of 600 mm/min, and a wire feeding speed of 5.5 m/min, under which good weld formation is achieved, and both stress and deformation are relatively low. The experimental results are basically consistent with the numerical simulation results.

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Published
2026-06-04
How to Cite
1.
Li M, Yang F, Wei X, Jia Z. STRESS ANALYSIS AND NUMERICAL SIMULATION STUDY OF COLD METAL TRANSFER WELD HEAD. MatTech [Internet]. 2026Jun.4 [cited 2026Aug.10];60(3):311–318. Available from: https://mater-tehnol.si/index.php/MatTech/article/view/1520